PCB machine features
1 using surface mount technology (
3 of goods to reduce working temperature, improve product reliability and power density, the use of
5 instead of fragile ceramic substrate, get very good mechanical durability.
The structure of
Cireuitl.Layer line: copper clad layer is equivalent to the general PCB line LOZ to 10oz, the thickness of copper foil.
Layer Dielcctric insulation layer: insulation layer is a layer of heat insulation material for thermal insulation. Thickness: 0.003 "to 0.006" inch is aluminum based copper clad laminate technology center address, has received UL certification.
Layer Base bottom: is the metal substrate, is generally aluminum or can choose copper. Aluminum based copper clad laminate and traditional epoxy glass cloth laminate, etc..
PCB aluminum substrate is composed of circuit layer, heat conduction insulation layer and metal bottom layer.. Circuit copper foil layer general after etching a printing circuit and the component parts are connected to each other, under normal circumstances, circuit layer need with large current carrying ability, should then be applied thick copper foil, thickness 35 mu m~280 m; heat conduction insulating layer is the address of the PCB aluminum substrate technology center, it is generally filled by special ceramics especially polymer, small thermal resistance and viscoelastic function outstanding, with thermal aging ability, able to withstand mechanical and thermal stress.
T-101, t-111, T-112, T-113, T-114 and t-200, t-300, T-400 and T-500, T-600, such as high power aluminum PCB substrate thermal insulating layer is precisely the use of this technology, which has very good heat conduction function and high strength of the electrical insulation function; at the bottom of the metal is aluminum substrate holding member, needs to have the high thermal conductivity, usually aluminum, but also the use of copper during copper can supply very good thermal conductivity), suitable for drilling, punching and cutting open, conventional machining. PCB material contrast with other materials not to compare the interests of. Appropriate power components surface mount SMT. Without the heat sink, the volume is greatly reduced, the cooling effect is excellent, excellent insulation and mechanical function.
PCB machine uses
1 audio equipment: input, output amplifier, balanced amplifier, audio amplifier, preamplifier, power amplifier, etc..
2 power equipment: `SW converter `DC/AC converter, etc..
3 communication electronic equipment: high frequency amplifier, filter circuit, electrical telegraphy.
4 office automation equipment: motor drives, etc..
5 car: electronic regulator 'ignition controller, etc..
6 computer: CPU board ` s floppy disk drive 'power supply equipment, etc..
7 power module: converter ` solid relay 'rectifier bridge, etc..
8 lamps and lanterns lamps: follow the suggestion of energy-saving lamps, apply to the aluminum substrate of LED lamp also beginning large-scale use.